ASE Concludes Groundbreaking Ceremony for a New Manufacturing Plant
Taipei, Taiwan, May 26, 2010 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today that it has concluded a ceremonial groundbreaking for the construction of Plant K12, at the Nantze Economic Processing Zone of Kaohsiung, Taiwan – ASE’s flagship manufacturing campus. The premier of Taiwan, Wu Den-yih and the mayor of Kaohsiung, Chen Chu were among the dignitaries gracing the event.
The 11-story Plant K12, with a floor area of 70, 200 square meters, is designated to provide expansion for ASE’s flipchip assembly and copper wirebond leadframe/substrate assembly lines. When completed in November of 2011, ASE expects to hire 6, 000 more employees.
As part of ASE’s emphasis on corporate social responsibility, the design and construction of Plant K12 will include several green concepts focusing on energy, material and water efficiency, environmental protection, waste reduction as well as the promotion of a healthy work environment. Such efforts will enable ASE to save as much as 20% energy consumption, and lower CO2 emissions of up to 10, 000 tons per year (equivalent to emissions from 2, 000 cars per year). ASE also aims to raise K12’s water recycling rate to 85% and harvest rainwater of up to 20, 000 gallons per year.
Upon the completion of Plant K12, ASE will apply for the EEWH (Ecology, Energy saving, Waste reduction and Health) diamond certificate, Taiwan’s green standard. ASE’s K12 will also work towards attaining the internationally recognized Leadership in Energy and Environmental Design (LEED) Go ld certification from the U.S. Green Building Council (USGBC).
ASE has also recently purchased a building from WUS Microelectronics in the recently purchased a building from WUS Microelectronics in the NEPZ and will rename it as Plant K15. Plant K15 is scheduled to begin manufacturing this July.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.