Press Room

2008 / 08 / 06

ASE Honored by Vitesse

Santa Clara, California, August 6, 2008 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today that it has received a Supplier of the Year award from Vitesse Semiconductor Corporation (Pink Sheets: VTSS). Vitesse, a leading provider of advanced IC solutions for Carrier and Enterprise Networks, selected ASE for consistently providing the technology and manufacturing acumen pertinent to the successful production of its sophisticated, high-performance communication devices.

ASE received the award based on the high level of performance achieved in all criteria defined by Vitesse to measure supplier performance, including quality, delivery, technology, value, and service. A previous recipient of this award, ASE provides a broad range of services to Vitesse, encompassing full turnkey assembly and test solutions for package types including flip chip, PBGA, and HSBGA, as well as bumping. ASE also supplies substrate to Vitesse.

“The strength of the working relationships we have with vendors contributes to Vitesse achieving its strategic objectives. ASE exemplifies the qualities and services we seek, ” said Roy Carew, vice president of Quality for Vitesse. “ASE’s integrity, agility and willingness to go above and beyond helps fuel the success of Vitesse in today’s highly competitive global market, so we are pleased to recognize their efforts with this award.”

“We are truly honored to receive this accolade from Vitesse, which represents a lot of dedication by ASE, ” said Rich Rice, senior vice president of sales, ASE Group. “Vitesse is a valued customer and we are proud to be able to bring our broad technology portfolio and leadership in innovation to help them better serve their customers.”


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.