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ASE Makes the List on Forbes Asia Fabulous 50 Companies 2014
The 2014 annual honor roll of the Fab 50 companies are rated the best of Asia-Pacific’s biggest publicly traded companies.
Taipei, August 29, 2014 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) proudly announced today that it has been listed in Forbes magazine’s 2014 Asia Fab 50 companies. In addition, ASE is the only company from Taiwan that made the list.
According to Forbes, The Fab 50 is chosen from a pool of 1, 300 companies in the Asia Pacific region that have at least $3 billion in market capitalization or annual revenue. These companies were analyzed and chosen based on a long series of performance measures, each company’s outlook as well as various factors, resulting in a list of the region’s best of the best.
ASE continues to lead the semiconductor industry with its cutting edge IC packaging and System-in-Package, material and test technologies. The company is a key player in providing the design, manufacturing and enabling of many electronic end products including smartphones, PCs, tablets, game consoles, security chipcards, automotive sensors, entertainment systems and many more.
As an industry leader, ASE is also the first company in Asia to issue Green Bond to raise $300 million to improve energy and water efficiency. This effort is part of ASE’s comprehensive corporate social responsibility to incorporate sustainability programs in its business model and organization.
About ASE, Inc.
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: ASE Website , or follow us on LinkedIn & X: @aseglobal.