Press Room

2015 / 12 / 01

ASE Receives Certification as a Qualified ICP Exporter from the Taiwan Bureau of Foreign Trade

Taipei, Taiwan, December 01, 2015 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, today announced that it has been certified by the Ministry of Economic Affairs, Bureau of Foreign Trade (BOFT) as a qualified Internal Compliance Program (ICP) exporter. The certification is valid for 3 years and allows ASE to apply for multiple export permits for strategic high tech go ods.

Violation of any export control regulation often results in hefty fines, significant business disruptions and serious damages to a company’s reputation. As such, compliance to complex trade regulations is a strategic and operational imperative of ASE’s export business. ASE, with assistance from the BOFT, has developed and implemented internal compliance programs to reduce the risks of export control violation through employee training and policies that manage the flow of go ods from the quotation stage, order processing to order fulfilment. Frequent audits by professional third party companies and self-assessment are conducted to ensure the integrity and robustness of ASE’s compliance measures.

ASE has also recently received the ISO 15408-EAL6 certification, a globally recognized standard that endorses a company for its capability to manage high security semiconductor products. Together with the ICP certification, ASE’s customers would benefit from the ease of go ods flow, a secure production process to a shortened time to market. The ISO 15408-EAL6 and ICP certifications elevate ASE as a global company that respects go verning laws, and further strengthen the company’s competitive leadership.


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.