ASE receives prestigious International Trade Award from the Ministry of Economic Affairs
Taipei, July 29, 2015 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) announced today that it has received the Excellent Importers & Exporters Certificate for Outstanding Contribution to International Trade, awarded by the Bureau of Foreign Trade, Ministry of Economic Affairs, Taiwan. The award recognizes ASE’s achievements in global trade and the development of overseas markets. A total of ten companies are selected as the Top Importers & Exporters each year. This year, ASE was ranked fourth, moving up from seventh position last year.
As a world leader in semiconductor assembly and test, ASE’s success is derived from the relentless pursuit of investing in technology innovation, building efficiency with ecosystem partners, and, collaborating with market leaders globally. ASE’s vast experience in IC assembly and test, combined with proven efficiency in managing complex IC and material logistics, has enabled the company to attain a leadership position in semiconductor System-in-Package. ASE’s competency in System-in-Package technology will help support customers to establish market leadership in their push for next generation applications in the era of Internet-of-Things, higher levels of integration, and on-premises intelligence.
“The ASE Group is an enterprise deeply rooted in Taiwan, and is proud to have contributed significantly to the economic growth experienced over the past three decades. ASE will continue to drive investments and develop its resources within Taiwan in order to reach out to our global customer-base, ” said Dr. Tien Wu, Chief Operating Officer, ASE Group.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.