Press Room

2006 / 08 / 29

ASE Selected by Medtronic to Package its Sophisticated Integrated Circuits for Medical Devices

Santa Clara, California, 29th August, 2006 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today that it has been selected by Medtronic, Inc. (NYSE: MDT) as its IC packaging and test services partner for a range of devices used in medical implantable pacemaker and defibrillator devices. ASE was chosen for its strength in technology, and its capability to provide Medtronic with full turnkey service.

While ASE has traditionally focused on solutions for applications within the 3 C’s sector, the company’s portfolio is expanding to include IC packaging and test solutions for highly complex medical applications. As the world’s leading provider of pacemaker and defibrillator devices, Medtronic depends upon reliable, quality, and highly-functional semiconductor chips to power its intricate devices.

By applying advanced technologies to integrate more features, functions, and performance, ASE delivers packaging solutions, which, combined with the integration of surface mount, wire bond, and flip chip interconnect technology, enable superior performance and functionality at the device level. ASE’s advanced wafer bumping technologies enable the fundamental interconnection between die and substrate, critical in reducing signal propagation delay, providing improved bandwidth, and relieving the constraints of power and ground distribution.

“Medtronic is making significant breakthroughs in the medical field and we are pleased that our technology and service is contributing to such a sophisticated line of life support products, ” said Rich Rice, senior vice president of sales, North America, ASE (U.S.) Inc. “Because of our extensive experience in providing turnkey solutions, we are able to share our expertise with Medtronic and assist them in getting their products to market faster. Additionally, ASE is expanding the company’s portfolio to include IC packaging solutions for highly complex medical applications.”


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.