Press Room

2001 / 02 / 22

ASE Unveils New Chip Manufacturing Technologies

Taiwan, Feb. 22, 2001 – Advanced Semiconductor Engineering (ASE, TAIEX:2311, NYSE:ASX ), one of the world’s largest semiconductor packaging and testing companies, unveiled today the availability of two new chip manufacturing technologies: Tape Carrier Package (TCP) and High Lead Bumping.

Commenting on these new technologies, J.J. Lee, vice-president of Research & Development at ASE said: “Over the past few years, as the demand for higher interconnection density and more automated production increased, TCP technology has become more widespread, and is no longer the sole dominion of IDMs. Through partnership with ASE, we are confident that any company that requires TCP can benefit from this technology. As the LCD market continues its exponential growth, it will require ever-higher picture quality (resolution) and extremely low profile IC packages. We are confident that TCP, which has the advantage of high-density interconnects as well as significant miniaturization potential, will become the package method of choice in the market.”

TCP packaging is fast becoming the mainstream for today’s LCD driver chips, and ASE’s introduction of this technique aims to enable the company to satisfy not only the rapidly rising demand for these chips, but also for other chips that require a small form factor and high-density interconnects. Throughout the entire process of TCP manufacturing – from the design and production of the tape, through bumping, and finally bonding – ASE is able to offer the most comprehensive high-quality service. Additionally, ASE utilizes Inner Lead Bonding (ILB) to make the TAB (Tape Automated Bonding) connection to the bumps on the die (chip core).

“Based on LCD industry figures, in 2000, Taiwan’s LCD market increased by 130% to NT$1.3 billion, and it is estimated that by 2003 at least 50% of all computers available globally will be notebooks. We believe this is the opportune time to begin offering this product line, and be able to ride the wave of the LCD market growth, ” says Mr Lee. He added:”We estimate that our TCP production capacity may expand to a million units per month in the first quarter of this year. In terms of technology, ASE can already position up to 480 interconnects on the smallest 50-micron LCD driver chips.”


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on Twitter: @aseglobal.

This site is registered on as a development site.