Press Room

2016 / 10 / 25

Visit from Minister Lee Ying-Yuan, Environmental Protection Administration, Executive Yuan, ROC (Taiwan) to ASE Kaohsiung’s Water Recycling Plant

Kaohsiung, Taiwan, October 25, 2016 – Tien Wu, COO, ASE Group and Raymond Lo, General Manager, ASE Kaohsiung hosted the visit of Minister Lee Ying-Yuan and his entourage at the ASE campus in Nantze Export Processing Zone (NEPZ) today.

The ASE management team briefed the visiting officials on ASE’s water management and environmental control processes. The group then proceeded for a tour of the K14 wastewater processing and recycling plant.

At the end of the visit, Minister Lee commended ASE on the efforts and progress that the company has made in environmental sustainability since the 2013 K7 wastewater incident. Following the incident, ASE has taken the opportunity to further strengthen its internal infrastructures and policies in the management of environmental issues including wastewater discharge processes. In April 2015, ASE began operating Taiwan’s largest state of the art wastewater processing and recycling plant at the NEPZ in Kaohsiung.

As the leading company in semiconductor assembly and test manufacturing, ASE not only takes pride in its water resource management, but also in its efforts to construct environmentally friendly buildings that are energy efficient, and are safe and healthy workplaces for its employees. From 2009, ASE embarked on green building programs to ensure that new properties are built according to international green standards while existing ones are refurbished. Today ASE has a total of 12 buildings that have received US LEED (Leadership in Energy & Environmental Design) go ld certifications.


About ASE, Inc.

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, automotive, 5G, high-performance computing, and more. To learn about our advances in SiP, fanout, MEMS and sensor, flip chip, and 2.5D, 3D and TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: ASE Website , or follow us on LinkedIn & X: @aseglobal.