Press Room

2016 / 11 / 01

ASE Makes CDP’s Climate A List For the First Time

ASE is the sole company from Taiwan and the only outsourced semiconductor manufacturer on the Climate A List issued by CDP, a non-profit global disclosure organization that promotes low carbon outputs and the disclosing of climate mitigation plans and risks.

Taipei, Taiwan, November 01, 2016 – Advanced Semiconductor Engineering, Inc (ASE, TAIEX: 2311, NYSE: ASX), the leading provider of semiconductor assembly and test services, today announced that it has made the CDP’s Climate A List for the first time. ASE is amongst 193 companies worldwide that was included in the list and also the only company from within the outsourced semiconductor manufacturing industry. Since 2009, ASE has been proactively responding to CDP’s questionnaires on carbon output disclosures and transparency in climate mitigation plans and risks. In 2015, ASE signed on as a signatory to CDP’s initiative 5.1. Climate Change and Energy Efficiency.

According to the newly released CDP report ‘Out of the Starting Block’, the CDP’s Climate A List comprises a strong set of companies who lead on climate change mitigation today and in the future. Approximately 2, 000 companies worldwide were assessed in 2016 and these companies were ranked from A to F. Those ranked A, were included in the Climate A List.

In the past year, ASE has shown significant improvements in promoting low carbon output as well as in the management of its greenhouse gas and carbon emissions. In 2015, ASE purchased a total of 7, 200 MWh of ‘accredited green electricity’ sourced from renewable energy under the ‘Green Power Pilot Program’ by the Bureau of Energy, Taiwan. This purchase has resulted in a reduction of CO2 emission of about 3, 754 metric tons equivalent to 312, 000 trees planted. To further promote a low carbon environment, ASE has committed to construct all new buildings according to international green building standards. Since 2012, ASE has invested over $270 million in green buildings. As of today, 16 buildings at ASE are certified by EEWH and LEED, with another 14 buildings undergo ing certification requirements. ASE is also playing its part in educating and supporting public initiatives on carbon footprint reduction by creating the ASE30 Environmental Conservation Fund. The fund was established to commemorate the company’s 30th anniversary and to promote programs in support of environmental protection efforts in Taiwan. The company has committed to contributing NT$100 million (US$3 million) per year from the NT$3 billion (US$100 million) fund for the next 30 years.

‘We are deeply honored to receive this recognition from CDP, which is an organization identified by global investors to have the most credible and beneficial sustainability reporting framework. The inclusion of ASE on the Climate A List is a strong endorsement of ASE and the team’s efforts in reducing our carbon footprint while balancing business performance and increasing long term shareholder value, ’ says Jason Chang, Chairman and CEO of the ASE Group. As we continue to be an innovative player in advanced semiconductor technology that forms the backbone of today’s electronic products, we remain committed to take the lead in creating a sustainable future that will reduce harm to humans and the environment, and to protect mother nature.

About CDP and CDP’s Climate A List
CDP is a not-for-profit organization that runs the global disclosure system for investors, companies, cities, states and regions to manage their environmental impacts. In October 2016, the organization released the first global report ‘Out of the Starting Block’ on behalf of 827 institutional investors representing more than $100 trillion in assets. The Climate A list details 193 companies that have excelled in the low-carbon movement and have an average carbon footprint around 80% lower compared to other firms. The report can be downloaded on CDP’s website


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.