Press Room

2004 / 02 / 25

Conexant Recognizes ASE with 2003 Supplier of the Year Award

Santa Clara, California, February 25, 2004 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and testing companies, announced today that it has received a 2003 Supplier of the Year Award from Conexant (Nasdaq: CNXT). ASE was selected from among many key suppliers in recognition of having demonstrated outstanding leadership in assembly and test. This award reflects ASE’s commitment to driving the future of emerging semiconductor technologies through its expertise in leading-edge packaging, substrate and test capabilities.

“We are very pleased to present this award to ASE, who has earned this recognition through their excellent customer service and support, ” said Karla Carichner, vice president of Operations for Conexant. “As a fabless semiconductor company, Conexant relies on the leadership capabilities of our suppliers to ensure the integrity of the assembly and test processes. In this capacity, ASE has clearly demonstrated their dedication to providing the highest caliber of services to Conexant.”

“ASE is honored to be recognized by a valued customer such as Conexant, ” said Dr Tien Wu, President of ASE Americas, Europe and Japan. “This accolade underscores ASE’s continued efforts to develop strategic long-term partnerships designed to support worldwide manufacturing service channels, while addressing ASE’s customer satisfaction initiative. We look forward to continuing our strategic relationship with Conexant, and successfully blending our superior core technologies with a flexible, responsive organization focused on supporting our customers’ business objectives and quality requirements.”


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.