ISE Offers Semiconductor Companies Worldwide Remote Access to Broad Range of Test Platforms
FREMONT, Calif., July 11, 2002 – ISE Labs, Inc., an ASE Test Company (Nasdaq: ASTSF – News), today introduced RAC (Remote Access) Services that enable semiconductor companies to access test equipment at its advanced technology centers in Silicon Valley and Austin. Through RAC Services companies can use ISE’s high-speed Internet access to connect to test systems with pin counts up to 1024 and speeds up to 3.2Gbps.
“Fabless companies in some regions have limited technology options, particularly for test, ” stated David Pan, CEO, ISE Labs. “In some locations, there is not a sufficient base of customers to support a full service technology center. For these customers, travel can be expensive and can mean investing a few hours or a full day to connect to the right test system. By enabling a secure yet user-friendly remote access service, companies can choose the most cost effective test platform for their application, shorten their development cycles and reduce their overall expense of test.”
Companies can connect to their choice of equipment at either of ISE’s Technology Centers through three different set-ups – Laptops, Unix Workstations, and PCs. ISE’s secure remote access is a Citrix-based web portal offering compressed Independent Computing Architecture (ICA) protocol data streams across industry standard 128-bit SSL encryption. Its fast data stream enables service to be used along low and high bandwidth links such as cable modems and ISDN. ISE’s RAC Service is offered with no license fee.
“We currently have customers in North America and Europe making use of RAC Services, and their response has been extremely favorable, ” stated Jeff Thompson, ISE IT Manager.
Companies can take part in an interactive session and sign up for a RAC account during ISE’s Open House on July 18(th) in Fremont, California.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on on LinkedIn and X: @aseglobal.