ASE recognized for excellence by Texas Instruments
SUNNYVALE, Calif., June 23, 2020 – Advanced Semiconductor Engineering, Inc. (ASE) has received the Texas Instruments (TI) 2019 Supplier Excellence Award. The annual award honors companies whose dedication and commitment in supplying products and services meet TI’s high standards for excellence. Recipients are an elite group of suppliers chosen for their exemplary performance in the areas of Cost, Environmental & Social Responsibility, Technology, Responsiveness, Assurance of Supply, and Quality.
TI does business with more than 12,000 suppliers, and there are a select few that it recognizes each year as the very best. To achieve this honor, ASE demonstrated throughout 2019 its commitment to the highest level of ethical behavior, as well as exceptional performance in key areas of manufacturing excellence. With a robust and reliable supply chain paramount to market success, ASE has consistently achieved the level of service and quality required to help TI produce compelling products and meet the needs of their customers.
“ASE is honored to receive this important accolade from TI, recognizing our significant team effort to consistently deliver on manufacturing excellence through dedicated commitment, strong relationships, and close collaboration,” said Jerry Chang, President of Sales, North America, Europe & Singapore. “At ASE, we are highly driven by our continuous pursuit of excellence in innovation, productivity, and quality, all ultimately geared towards the ongoing success of our customers.”
TI announced the award on June 23, 2020.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on on LinkedIn and X: @aseglobal.