Press Room

NEWS
2022 / 03 / 02

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

The organization, representing a diverse ecosystem of market segments, will address customer requests for more customizable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

“The age of Chiplets has truly arrived, driving the industry to evolve from silicon-centric thinking to system level planning and placing crucial focus on co-design of IC and package. We are confident that UCIe will play a pivotal role in enabling ecosystem efficiencies, by lowering development time and cost through open standards for interfaces between various IPs within a multi-vendor ecosystem as well as utilization of advanced package level interconnect. There is broad industry recognition that Heterogeneous Integration will help bring Chiplet-based designs to market,” said Dr. Lihong Cao, Director of Engineering and Technical Marketing, ASE. “Given ASE’s expertise in packaging, assembly, and interconnect platform technology, we will provide UCIe with meaningful perspective to ensure forthcoming standards are practicable, complemented by commercially viable performance and manufacturing costs for package level manufacturing.”

Universal Chiplet Interconnect Express (UCIe) Specification now available

The founding companies also ratified the UCIe specification, an open industry standard developed to establish a ubiquitous interconnect at the package level. The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols, and software stack which leverage the well-established PCI Express® (PCIe®) and Compute Express Link™ (CXL™) industry standards. The specification will be available to UCIe members and available to download on the website.

Open for membership

The founding companies represent a wide range of industry expertise and include leading cloud service providers, foundries, system OEMs, silicon IP providers, and chip designers, and they are in the process of finalizing incorporation as an open standards body. Upon incorporation of the new UCIe industry organization later this year, member companies will begin work on the next generation of UCIe technology, including defining the chiplet form factor, management, enhanced security, and other essential protocols. To learn more about membership opportunities, contact admin@UCIexpress.org.

Resources:

 

About Universal Chiplet Interconnect Express (UCIe)

Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company are forming an open industry standard organization to promote and further develop the technology, and to establish a global ecosystem supporting chiplet design. For more information, visit www.UCIexpress.org.

PCI-SIG, PCI Express, and PCIe are registered trademarks of PCI-SIG. Compute Express Link™ and CXL™ Consortium are trademarks of the Compute Express Link Consortium. All other trademarks are the property of their respective owners.


 

About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on on LinkedIn and X: @aseglobal.