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Patch-type Flex SiP Platform for Heathcare Application
Ming-Hung Chen; Wei-Hao Chang; Hui-Ping Jian; Chao-Wei Liu; Shang-Lin Wu; Yi-Chun Chou; Sung-Hung Chian; Jun-Kai Chang; Tun-Ching Pi; Wei-Chun Lee; Jen-Chieh Kao and Yung-I Yeh
All day health monitoring providing real-time body signal detection for decease check and life quality enhancement is becoming a megatrend these years. However, the precious yet limited clinical facility and medical professionals cannot fulfill the emerging needs. A wearable device such like smart watch utilizing bio-sensor-integrated System-in-Package (SiP) module can provide a real time and personal-based bio data collection as well as better health management through AI assistance. For performing a more comfortable experience as SiP application, new wearable device with lower profile and higher structure flexibility are considered. In this study, Patch-type SiP platform for ECG monitoring as a model had studied. The patch durability by 100,000 times rolling test as simulating daily use condition was also examined.
Published in: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
