System-in-package (SiP) modules are widely used in portable electronics such as Internet of Things (IoT) devices and mobile consumer equipment since they integrate multiple components in a single package and thus facilitate device miniaturization. An advanced packaging technology referred to as dual-side molding (DSM) has recently been proposed as… Read More
IoT envisions connection of trillions of devices around the world to data centers, and enables applications with the network connected. Nevertheless, SiP opportunities stay with two fundamental requests: miniaturization benefits and valuable market size. These are by no means for comprehensive listing of the IoT devices that will be deployed… Read More
There are still many unknowns as we continue through challenging global times. However, it is inspiring to see such game-changing innovation within the semiconductor industry, ultimately enabling applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, from 5G to beyond. Collectively,… Read More
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