This is posts with tag name "SiP"

post

Advanced Packaging from FOWLP to FOPLP Development of FanOut Chip Last in 300 mm Panel

As the demand for high-performance computing (HPC) continues to rise, processor designs are evolving towards chiplet integration and ASIC-HBM architectures, leveraging high-density interconnection technologies. While wafer-level fan-out packaging (FOWLP) has become a widely adopted solution, it faces challenges such as warpage control, complex processes, and carrier utilization limitations. To address… Read More

post

Technology Enhancements on FOCoS-Bridge for Emerging Trends in HPC and AI

In the rapidly evolving fields of High-Performance Computing (HPC) and Artificial Intelligence (AI), the demand for higher bandwidth, greater I/O density, and improved thermal dissipation is increasing. To meet these challenges, we are proud to introduce “FOCoS-Bridge with TSV” as an advancement to ASE’s VIPack™ FOCoS-Bridge technology. This enhancement integrates a bridge… Read More

post

Innovation and Collaboration in Power Module Packaging: A Thermal Perspective

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power. As the demand for more power in smaller and lighter systems grows, managing heat dissipation has become a major challenge, as the thermal… Read More

post

AI and Semiconductor in Reciprocity

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drives the development of semiconductor technologies, with both complementing each other. Semiconductor Packaging: The Bridge… Read More

post

High Accuracy Selective Patterning for EMI Shielding of 5G AiP

System-in-Package (SiP) module with higher component density and smaller form size was demonstrated through selective structure. The selective EMI shielding at partial molding area for specific substrate circuit exposure through roller-type auto taping / detaping of PI tape was performed. This PI tape was applied on to designed area and… Read More

post

Advanced Packaging Design for Heterogeneous Integration

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, Edge AI and Autonomous Electrical… Read More

post

Patch-type Flex SiP Platform for Heathcare Application

All day health monitoring providing real-time body signal detection for decease check and life quality enhancement is becoming a megatrend these years. However, the precious yet limited clinical facility and medical professionals cannot fulfill the emerging needs. A wearable device such like smart watch utilizing bio-sensor-integrated System-in-Package (SiP) module can… Read More