post
As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional… Read More
post
In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drives the development of semiconductor technologies, with both complementing each other. Semiconductor Packaging: The Bridge… Read More
post
As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as… Read More
post
In chiplet integration applications, various chips from different vendors can be integrated into one package structure using the Universal Chiplet Interconnect Express (UCIe) standard. Fan-Out Chip on Substrate (FOCoS) is a promising advanced package that can achieve high channel density and high bandwidth. However, crosstalk in high-speed signals is a… Read More
post
The world is rapidly transitioning from an internet economy to an AI economy. In the internet economy, we stayed constantly connected to the internet 24/7 through our smartphones, PCs, and IoT devices. However, in the AI economy, every aspect of our lives are interwoven with artificial intelligence. You may already… Read More
post
High density fan-out-chip-on-substrate-embedded bridge (FOCoS-Bridge) technology has been successfully built on a large chip module incorporated ten (10) chiplets and ten (10) silicon (Si) bridge dies with more than three times (3X) silicon reticle size. One of the most difficult aspects of this large body size is the chip on… Read More
post
The development of highly reliable packaging products is paramount, as accurately predicting the thermal resistance values (Theta JA, JB, JC) of IC packages is crucial for calculating maximum power dissipation and mitigating self-heating effects. In this paper, we focus on the prediction and analysis of thermal resistance in packaged products. Read More
post
In the manufacturing industry, producing a large quantity of highquality products every day is the top priority. Recently, the integration of Automated Optical Inspection (AOI) equipment and Deep Neural Network (DNN) defect image predictions has demonstrated a significant reduction in manual effort required for defect inspection in manufacturing industrial applications. Read More
post
Artificial Intelligence (AI) is changing the world and improving our lives in many ways. The semiconductor industry is a key part of the AI revolution, as it provides powerful computing chips for AI applications and leverages AI to optimize business operations and management, customer service, office workflows, as well as… Read More
