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Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in-Package (SiP) Modules
System-in-package (SiP) modules are widely used in portable electronics such as Internet of Things (IoT) devices and mobile consumer equipment since they integrate multiple components in a single package and thus facilitate device miniaturization. An advanced packaging technology referred to as dual-side molding (DSM) has recently been proposed as… Read More
