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As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional… Read More
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In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drives the development of semiconductor technologies, with both complementing each other. Semiconductor Packaging: The Bridge… Read More
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In order to ensure the performance of high-frequency fan-out package design, especially at mmWave application, the influence of substrate dielectric characteristic is very serious. Polyimide (PI) material is common material used in Fan-out package. The moisture effect of PI is very obvious in stress and electrical performance. So this paper… Read More
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5G communication has been widely implemented since year 2020, especially for FR1 sub-6GHz range. Band n77, n78 and n79 are three critical bands in the 5G FR1 because of higher frequency and much wider bandwidth – This also brings new challenge on filter design. In this work, we propose a… Read More
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Heterogeneous integration technology makes possible the integration of multiple separately manufactured components into a single higher level assembly with enhanced functionality and improved operating characteristics. Various types of advanced heterogeneous packages are available, including 2.5-D integrated circuit (IC), fan-out chip on substrate (FOCoS) chip-first, and FOCoS chip-last. This study constructs… Read More
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The demand for high bandwidth and high-performance applications such as networking, AI computing and GPU IC chips are driving innovative developments in advanced IC packaging. Heterogeneous integration enables the integration of multiple chips using fine line/space interconnect packaging technology. Heterogeneous integration packaging solutions offered in the market today include, through… Read More
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In recent years, Fan-Out (FO) packages have become widely used in handheld, mobile consumer and internet of things (IoT) devices. FO packaging allows greater I/O density as well as the ability to pack multiple components in the same package compared to conventional wafer level chip scale package (WLCSP). Several types… Read More
