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Borrowing the digital twin spirit, the virtual model (CAE simulated) and the physical model (real tests) were used to construct the lifecycle prediction curve for Molded Flip-Chip Ball-Grid-Array Package (MFCBGA) with SAC305 solder ball. The energy based Morrow’s model was used to fit the data points from both virtual and… Read More
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In view of the continuous growth of digital-twin in the technology and industry in recent years, we conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging. The underfill dispensing patterns were investigated with… Read More
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The 5th Generation wireless systems popularity will push the package development into a high performance and heterogeneous integration form. Electronic products will be thinner and smaller, high-speed, high I/O density and other characteristics. So Bump diameter and Bump pitch design will gradually become smaller or narrower to meet the bump… Read More
