2023 / 05 / 23

Underfill Dispensing Patterns in Flip-Chip Packaging

Dao-Long Chen; Hui-Jing Chang; Tang-Yuan Chen; Yung-Hsiang Hu; Ting-Bin Chen; Chi-Hung Pan; Yu-Shuo Yang; Sheng-Jye Hwang

In view of the continuous growth of digital-twin in the technology and industry in recent years, we conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.

The underfill dispensing patterns were investigated with exactly characterizations of viscosity and curing degree. The test vehicle FCBGA with two chips and complex bump layouts were used for virtual and physical models. The gap effect causes the higher flow rate than edge effect. Both effects are important because they can easily lead to the air-trapped voids.

The optimized dispensing pattern may need many trials. These trials implemented by physical dispensing can waste more time and many costs. On the contrary, the virtual dispensing model can do the trails more efficiently. This is the one spirit of the digital-twin, and the key from automatization to intellectualization in Industry 4.0.

Published in: 2023 International Conference on Electronics Packaging (ICEP)