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Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)

This work discusses that the manufacturing tolerances and material characteristic of 4+2+4 multi-layer substrate impact on performance of Millimeter-wave (mmWave) antenna-in/on-package (AiP/AoP). The designed test kits to extract the material characteristic of multi-layer substrate including T-resonator, microstrip transmission line, and microstrip patch antenna. The stacking patch antenna implemented on 4+2+4… Read More