Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)
Cheng-Yu Ho; Sheng -Chi Hsieh; Hong-Sheng Huang; Chia-Ching Chu; Chen-Chao Wang
This work discusses that the manufacturing tolerances and material characteristic of 4+2+4 multi-layer substrate impact on performance of Millimeter-wave (mmWave) antenna-in/on-package (AiP/AoP). The designed test kits to extract the material characteristic of multi-layer substrate including T-resonator, microstrip transmission line, and microstrip patch antenna. The stacking patch antenna implemented on 4+2+4 multi-layer substrate, and also discusses the manufacturing tolerances impact on performance of mmWave AiP/AiM. The correlation between measurement and simulation with extracted material characteristic and manufacturing tolerance shows that the frequency response is less than 0.1GHz from 24GHz to 30GHz. This simulation result has good correlation with the measurement result.
Published in: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)