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As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, Edge AI and Autonomous Electrical… Read More
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All day health monitoring providing real-time body signal detection for decease check and life quality enhancement is becoming a megatrend these years. However, the precious yet limited clinical facility and medical professionals cannot fulfill the emerging needs. A wearable device such like smart watch utilizing bio-sensor-integrated System-in-Package (SiP) module can… Read More
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System-in-package (SiP) modules are widely used in portable electronics such as Internet of Things (IoT) devices and mobile consumer equipment since they integrate multiple components in a single package and thus facilitate device miniaturization. An advanced packaging technology referred to as dual-side molding (DSM) has recently been proposed as… Read More
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IoT envisions connection of trillions of devices around the world to data centers, and enables applications with the network connected. Nevertheless, SiP opportunities stay with two fundamental requests: miniaturization benefits and valuable market size. These are by no means for comprehensive listing of the IoT devices that will be deployed… Read More
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5G communication has been widely implemented since year 2020, especially for FR1 sub-6GHz range. Band n77, n78 and n79 are three critical bands in the 5G FR1 because of higher frequency and much wider bandwidth – This also brings new challenge on filter design. In this work, we propose a… Read More
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There are still many unknowns as we continue through challenging global times. However, it is inspiring to see such game-changing innovation within the semiconductor industry, ultimately enabling applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, from 5G to beyond. Collectively,… Read More
