ASE Breaks Ground for New Factory Buildings in Kaohsiung
Taipei, April 12th, 2013 – Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, broke ground today to mark the construction of two new buildings – B and C, at the Kaohsiung Nantze Export Processing Zone II. The new buildings are part of ASE’s plans to expand its manufacturing capacity for advanced semiconductor packaging processes and its R&D center.
Earlier last year, ASE broke ground for the construction of building A, which is due to be completed at the end of 2013. Buildings A and B are designated for production, while building C will be the R&D center. The land area housing these buildings is 13, 238 square meters, while the build up production area is 75, 549 square meters. Completion of the construction of buildings B and C is estimated to be in the third quarter of 2014. These building projects are constructed based on green design concepts and ASE has implemented a framework to meet the criteria set by Taiwan’s EEWH and US Green Council’s LEED (Leadership in Energy and Environmental Design) for green building certification. In consideration of the environment and community, the architecture design at the ASE campus will include greenery, art and culture. ASE employees can look forward to a high tech yet eco-friendly, healthy and comfortable workplace.
Technology continues to drive the plethora of smart devices available in the consumer market, such as smartphones and tablets. IC chip designers are continuously designing smaller, lighter and more powerful semiconductors that require higher pincount, narrower pitch traces and miniaturization. ASE Kaohsiung’s new factories will provide customers access to production capacities using more advanced process capabilities in bumping, copper pillar, TSV, flip chip and 3D IC packaging. Our R&D center will hire about 160 engineers to develop and work with customers on advanced technologies. With the development of the R&D center, ASE hopes to register 250-300 new patents each year, boosting our competitive advantage. Buildings B and C will also open up hiring opportunities for over 3, 500 new employees and add potential revenue of $530 million per year.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.