Press Room

2011 / 06 / 10

ASE Rises To The Top Of The List In The 2011 Asia/Taiwan Info Tech 100 Enterprises

Taipei, Taiwan, June 10, 2011 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, announced today that it was honored by Business Next Magazine in the publication’s special edition of the “Asia Info Tech100”. In this year’s judging for Taiwan’s Top 100 Tech Enterprises and Asia’s Top 100 Tech Enterprises, ASE was ranked number 3 and number 6 respectively.

The Info Tech 100 list is compiled annually by Taiwan’s Business Next Magazine and was launched in the year 2000 through a licensing agreement with New York-based Businessweek Magazine (now know as Bloomberg Businessweek). In the catego ry, Taiwan’s Top 100 Tech Enterprises, over 700 publicly listed Taiwanese tech companies were evaluated based on 5 key criteria including revenue performance, revenue growth, profitability, shareholders’ return and return on equity over the 12 months of 2010. Similarly, under the catego ry of Asia’s Top 100 Tech Enterprises, over 2000 publicly listed companies from 9 countries in the Asia region were evaluated on the same basis.

ASE is proud to be ranked in the top 10 on both the Taiwan and Asia list, having moved up from number 16 and number 100 on the 2010 and 2009 Taiwan Info Tech 100 list respectively.

The 2011 accolade is a timely recognition of ASE’s outstanding performance in the past decade, and our continuous transformation to enable us to standout in a dynamic technology environment. It is also a vote of confidence for our customers, employees and shareholders, helping to assure them of ASE’s commitment and our long term strategy to maintain a world class enterprise.


About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: or follow us on on LinkedIn and X: @aseglobal.